Your Trusted Partner in Semiconductor Assembly and Testing

UNICHIPS is a package service provider specializing in non-memory semiconductors, particularly ASICs (Application-Specific Integrated Circuits). Our main business focuses on supporting customers in the development and manufacturing of packages for their prototypes and volume production parts.

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Your Trusted Partner in Semiconductor Assembly and Testing.

UNICHIPS is a package service provider specializing in non-memory semiconductors, particularly ASICs (Application-Specific Integrated Circuits). Our main business focuses on supporting customers in the development and manufacturing of packages for their prototypes and volume production parts.
We support a wide range of package types, including SOP, SOT, QFP, QFN, BGA, and Bumping, tailored to meet customer requirements.
In particular, we provide prototype package manufacturing services with quick lead times and competitive pricing.

Our Services

We provide the best package solutions for both Prototype Package and Volume Production.
We support the development of Custom Package and COB (Chip On Board) products.
We also provide support for various processes such as Wafer Back Grinding and Sawing Service.

Fast-turn Prototype Service

  • Prototype
  • Domestic Factory
  • FCBGA, FBGA
  • LQFP, TQFP, QFN
  • SIP, MCP
  • Open PKG
  • Rapid Lead Time
  • 1 ~ 14 days
factory

Volume Production Service

  • Volume Product
  • China Factory
  • FCBGA, FBGA
  • WLCSP(Bump)
  • SSOP, SOP, SOT
  • LQFP, TQFP, MQFP
  • QFN, MLF
  • Lowest Cost
engineering

Engineering Service

  • Custom PKG Design
  • COB(Chip On Board)
  • Wire Bonding
  • Wafer Back Grinding
  • Sawing
  • Board Development

Our Services

We provide the best package solutions for both Prototype Package and Volume Production.
We support the development of Custom Package and COB (Chip On Board) products.
We also provide support for various processes such as Wafer Back Grinding and Sawing Service.

Fast-turn Prototype Service

  • Prototype
  • Domestic Factory
  • FCBGA, FBGA
  • LQFP, TQFP, QFN
  • SIP, MCP
  • Open PKG
  • Rapid Lead Time
  • 1 ~ 14 days

Volume Production Service

  • Volume Product
  • China Factory
  • FCBGA, FBGA
  • WLCSP(Bump)
  • SSOP, SOP, SOT
  • LQFP, TQFP, MQFP
  • QFN, MLF
  • Lowest Cost

Engineering Service

  • Custom PKG Design
  • COB(Chip On Board)
  • Wire Bonding
  • Wafer Back Grinding
  • Sawing
  • Board Development

Our Services

We provide the best package solutions for both Prototype Package and Volume Production.
We support the development of Custom Package and COB (Chip On Board) products.
We also provide support for various processes such as Wafer Back Grinding and Sawing Service.

Prototype Package Service

We provide a variety of sample packages that are most suitable for our customers' products.

COB

  • COB(Chip On Board)
  • PCB Design
  • Die Attach, Wire Bonding, Molding

Open PKG

  • Rapid Lead Time(1~3 days)
  • 10DFN(3x3), 32QFN(5x5)
  • 64QFN(9x9), 64LQFP(10x10)

QFN, MLF

  • DFN, QFN, MLF
  • Saw Type, Punch Type
  • Lead Count: 8, 16, 32, 44, 48, 64, 68, 76, 88, 100, 144 and etc

LQFP, TQFP

  • LQFP Lead Count: 32, 48, 64, 80, 100, 128, 144, 176, 208, 256
  • TQFP Lead Count: 32, 48, 64, 80, 100, 128, 144, 176
  • Exposed Pad Type PKG Available

FCBGA

  • Flip Chip BGA Package
  • Solder Bump, CU Pillar
  • Ball Count: 100, 256~664, 2025 and etc

PBGA

  • Plastic Ball Grid Array
  • Body Size: 17mm ~ 40mm
  • Ball Counts: up to 1521

CABGA/FBGA

  • ChipArray Package
  • LFBGA, TFBGA, VFBGA, LGA
  • Body Size: 1.5mm ~ 27mm
  • Ball Counts: 4 ~ 700 ball
  • Flip Chip CSP/Stacked CSP

WLCSP

  • Solder Bump
  • CU Pillar
  • Gold Bump
  • Au Stud Bump
  • 6 inch, 8 inch, 12 inch wafer

Do you have any further questions?

If you have any inquiries, feel free to contact us via email or phone. We’ll respond promptly.

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